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Patent Assignment Details
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Reel/Frame:014520/0423   Pages: 3
Recorded: 04/14/2004
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
10739891
Filing Dt:
12/18/2003
Publication #:
Pub Dt:
06/23/2005
Title:
Method and apparatus for acid and additive breakdown removal from copper electrodeposition bath
Assignors
1
Exec Dt:
04/12/2004
2
Exec Dt:
04/12/2004
Assignee
1
3050 BOWERS AVENUE
SANTA CLARA, CALIFORNIA 95054
Correspondence name and address
APPLIED MATERIALS, INC.
ROBERT W. MULCAHY
P.O. BOX 1450
SANTA CLARA, CA 95052

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