Patent Assignment Details
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Reel/Frame: | 014521/0182 | |
| Pages: | 4 |
| | Recorded: | 09/24/2003 | | |
Conveyance: | RECORD TO CORRECT THE ASSIGNEE'S ADDRESS. DOCUMENT PREVIOUSLY RECORDED ON REEL 013843 FRAME 0106. ASSIGNOR HEREBY CONFIRMS THE ASSIGNMENT OF THE ENTIRE INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/17/2006
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Application #:
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10240251
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Filing Dt:
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09/30/2002
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Publication #:
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Pub Dt:
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07/03/2003
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Title:
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METHOD FOR DICING SEMICONDUCTOR WAFER INTO CHIPS
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Assignee
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1, AZA NAGAHATA, OAZA OCHIAI |
HARUHI-CHO |
NISHIKASUGAI-GUN, AICHI, JAPAN 452-8564 |
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Correspondence name and address
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MCGINN & GIBB, PLLC
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SEAN M. MCGINN, ESQ.
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8321 OLD COURTHOUSE ROAD
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SUIE 200
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VIENNA, VA 22182-3817
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