Patent Assignment Details
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| Reel/Frame: | 014530/0840 | |
| Pages: | 4 |
| | Recorded: | 06/26/2003 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10450844
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Filing Dt:
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06/26/2003
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Publication #:
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Pub Dt:
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05/12/2005
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Title:
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Multi-layer wiring board, method for producing multi-layer wiring board, polishing machine for multi-layer wiring board, and metal sheet for producing wiring board
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Assignee
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| 32-1 MINAMI-OTSUKA 3-CHOME, TOSHIMA-KU |
| TOKYO 170-0005, JAPAN |
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Correspondence name and address
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ARMSTRONG, WESTERMAN & HATTORI, LLP
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SUITE 1000
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1725 K STREET NW,
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WASHINGTON, DC 20006
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