Patent Assignment Details
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| Reel/Frame: | 014547/0435 | |
| Pages: | 3 |
| | Recorded: | 09/30/2003 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/15/2003
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Application #:
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09781995
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Filing Dt:
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02/14/2001
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Publication #:
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Pub Dt:
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08/15/2002
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Title:
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METHOD FOR REDUCING THERMAL LOSS AND PROVIDING MECHANICAL COMPLIANCE IN A SEMICONDUCTOR PACKAGE AND THE SEMICONDUCTOR PACKAGE FORMED THEREFROM
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Assignee
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| 2300 NORTHEAST BROOKWOOD PARKWAY |
| HILLSBORO, OREGON 97124 |
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Correspondence name and address
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DICKSTEIN SHAPIRO MORIN & OSHINSKY LLP
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ELLEN S. TAO
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2101 L STREET NW
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WASHINGTON, DC 20037-1526
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