Patent Assignment Details
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| Reel/Frame: | 014562/0083 | |
| Pages: | 4 |
| | Recorded: | 10/03/2003 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/03/2005
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Application #:
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10413574
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Filing Dt:
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04/15/2003
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Publication #:
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Pub Dt:
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01/01/2004
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Title:
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RESIDUE-FREE SOLDER PASTE
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Assignees
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| 3-6-3 HIGASHINAKANO |
| NAKANO-KU, TOKYO, JAPAN |
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| 23 SENJU-HASHIDO-CHO |
| ADACHI-KU, TOKYO 120-8555, JAPAN |
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Correspondence name and address
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MICHAEL TOBIAS
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#40
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1717 K STREET N.W.
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SUITE 613
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WASHINGTON, D.C. 20036
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