Patent Assignment Details
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| Reel/Frame: | 014593/0200 | |
| Pages: | 3 |
| | Recorded: | 10/14/2003 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10151783
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Filing Dt:
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05/20/2002
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Publication #:
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Pub Dt:
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11/20/2003
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Title:
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Non-foamed polishing pad and polishing method therewith
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Assignee
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| 3-4-1 MUSASHINO, AKISHIMA |
| TOKYO, JAPAN |
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Correspondence name and address
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BEYER WEAVER & THOMAS, LLP
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KEIICHI NISHIMURA
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P.O. BOX 778
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BERKELEY, CA 94704-0778
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