Patent Assignment Details
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| Reel/Frame: | 014618/0557 | |
| Pages: | 2 |
| | Recorded: | 10/14/2003 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/12/2005
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Application #:
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10686435
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Filing Dt:
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10/14/2003
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Publication #:
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Pub Dt:
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10/21/2004
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Title:
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METHOD OF PLATING METAL LAYER OVER ISOLATED PADS ON SEMICONDUCTOR PACKAGE SUBSTRATE
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Assignee
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| NO. 6, LI-HSIN ROAD |
| SCIENCE BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN ROC |
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Correspondence name and address
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ROBERT BERLINER
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FULBRIGHT & JAWORSKI LLP
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865 SOUTH FIGUEROA
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29TH FLOOR
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LOS ANGELES, CA 90017-2571
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