Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Reel/Frame: | 014623/0027 | |
| Pages: | 3 |
| | Recorded: | 05/18/2004 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
Total properties:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
10772510
|
Filing Dt:
|
02/05/2004
|
Publication #:
|
|
Pub Dt:
|
08/26/2004
| | | | |
Title:
|
Method and apparatus for examining semiconductor wafers in a context of die/SAW design
|
|
Assignee
|
|
|
ERNST-LEITZ-STRASSE 17-37 |
WETZLAR, GERMANY D-35578 |
|
Correspondence name and address
|
|
HOUSTON ELISEEVA
|
|
4 MILITIA DRIVE, SUITE 4
|
|
LEXINGTON, MA 02421
|
Search Results as of:
05/15/2024 04:44 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|