Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 014636/0211 | |
| Pages: | 4 |
| | Recorded: | 05/17/2004 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
3
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10076433
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Filing Dt:
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02/19/2002
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Publication #:
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Pub Dt:
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10/31/2002
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Title:
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High strength titanium copper alloy, manufacturing method therefor, and terminal connector using the same
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10105454
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Filing Dt:
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03/26/2002
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Publication #:
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Pub Dt:
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12/19/2002
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Title:
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Copper, copper alloy, and manufacturing method therefor
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10397200
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Filing Dt:
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03/27/2003
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Publication #:
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Pub Dt:
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11/13/2003
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Title:
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Copper alloy material having efficient press properties and process for production thereof
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Assignee
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| 3, KURAMI, SAMUKAWA-MACHI |
| KOSA-GUN |
| KANAGAWA 253-0101, JAPAN |
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Correspondence name and address
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OLIFF & BERRIDGE, PLC
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WILLIAM P. BERRIDGE
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P.O. BOX 19928
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ALEXANDRIA, VA 22320
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