Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 014646/0385 | |
| Pages: | 5 |
| | Recorded: | 11/03/2003 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
10
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Patent #:
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Issue Dt:
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12/24/1991
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Application #:
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07452191
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Filing Dt:
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12/18/1989
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Title:
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FLIP CHIP TECHNOLOGY USING ELECTRICALLY CONDUCTIVE POLYMERS AND DIELECTRICS
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Patent #:
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Issue Dt:
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03/23/1993
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Application #:
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07746333
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Filing Dt:
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08/16/1991
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Title:
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FLIP CHIP BONDING METHOD USING ELECTRICALLY CONDUCTIVE POLYMER BUMPS
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Patent #:
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Issue Dt:
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08/17/1993
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Application #:
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07810513
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Filing Dt:
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12/19/1991
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Title:
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FLIP CHIP TECHNOLOGY USING ELECTRICALLY CONDUCTIVE POLYMERS AND DIELECTRICS
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Patent #:
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Issue Dt:
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03/18/1997
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Application #:
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08387024
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Filing Dt:
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02/10/1995
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Title:
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METHOD OF FORMING ELECTRICALLY CONDUCTIVE POLYMER INTERCONNECTS ON ELECTRICAL SUBSTRATES
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Patent #:
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Issue Dt:
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03/09/1999
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Application #:
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08503622
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Filing Dt:
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07/18/1995
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Title:
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METHOD FOR FORMING ELECTRICALLY CONDUCTIVE POLYMER INTERCONNECTS ON ELECTRICAL SUBSTRATES
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Patent #:
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Issue Dt:
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07/06/1999
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Application #:
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08818634
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Filing Dt:
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03/14/1997
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Title:
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METHOD OF FORMING ELECTRICALLY CONDUCTIVE POLYMER INTERCONNECTS ON ELECTRICAL SUBSTRATES
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Patent #:
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Issue Dt:
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10/31/2000
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Application #:
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09264396
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Filing Dt:
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03/08/1999
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Title:
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METHOD OF FORMING ELECTRICALLY CONDUCTIVE POLYMER INTERCONNECTS ON ELECTRICAL SUBSTRATES
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Patent #:
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Issue Dt:
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04/24/2001
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Application #:
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09274748
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Filing Dt:
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03/23/1999
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Title:
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FLIP CHIP MOUNTING TECHNIQUE
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Patent #:
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Issue Dt:
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02/20/2001
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Application #:
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09378847
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Filing Dt:
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08/23/1999
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Title:
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FLIP CHIP MOUNTING TECHNIQUE
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Patent #:
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Issue Dt:
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06/25/2002
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Application #:
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09724019
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Filing Dt:
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11/28/2000
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Title:
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FLIP CHIP MOUNTING TECHNIQUE
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Assignee
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| 14 FORTUNE DRIVE |
| BILLERICA, MASSACHUSETTS 01821 |
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Correspondence name and address
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T.A. LOBER PATENT SERVICES
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THERESA A. LOBER
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45 WALDEN STREET
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SUITE 2D
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CONCORD, MA 01742
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