Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 014656/0727 | |
| Pages: | 5 |
| | Recorded: | 11/05/2003 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
2
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Patent #:
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Issue Dt:
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08/19/2003
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Application #:
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09656657
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Filing Dt:
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09/07/2000
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Title:
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METHOD FOR FORMING A CU INTERCONNECT PATTERN
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10127927
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Filing Dt:
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04/23/2002
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Publication #:
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Pub Dt:
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10/31/2002
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Title:
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Sn-Ag-Cu solder and surface treatment and parts mounting methods using the same
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Assignee
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| 2-2, YAESU |
| CHUO-KU, TOKYO, JAPAN 104-0028 |
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Correspondence name and address
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MICHAEL BEST & FRIEDRICH LLC
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PERRY J. HOFFMAN
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401 NORTH MICHIGAN AVENUE
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SUITE 1900
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CHICAGO, IL 60611
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