Patent Assignment Details
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| Reel/Frame: | 014670/0831 | |
| Pages: | 2 |
| | Recorded: | 10/31/2003 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10699527
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Filing Dt:
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10/31/2003
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Publication #:
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Pub Dt:
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05/13/2004
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Title:
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Chemical mechanical polishing system and method for planarizing substrates in fabricating semiconductor devices
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Assignee
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| NO. 3, LI-HSIN RD., 2 SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU CITY, TAIWAN R.O.C. |
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Correspondence name and address
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DICKINSON WRIGHT PLLC
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THOMAS T. MOGA
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1901 L STREET NW, SUITE 800
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WASHINGTON, DC 20036
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