Patent Assignment Details
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| Reel/Frame: | 014671/0689 | |
| Pages: | 4 |
| | Recorded: | 11/04/2003 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/19/2005
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Application #:
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10701311
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Filing Dt:
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11/04/2003
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Publication #:
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Pub Dt:
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05/05/2005
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Title:
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HIGH DENSITY MICROVIA SUBSTRATE WITH HIGH WIREABILITY
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Assignee
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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Correspondence name and address
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IBM CORPORATION
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WILLIAM H. STEINBERG
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1701 NORTH STREET 1Q0A/040-3
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INTELLECTUAL PROPERTY LAW DEPT.
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ENDICOTT, NEW YORK 13760
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