Patent Assignment Details
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| Reel/Frame: | 014690/0629 | |
| Pages: | 4 |
| | Recorded: | 11/10/2003 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10703488
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Filing Dt:
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11/10/2003
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Publication #:
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Pub Dt:
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05/13/2004
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Title:
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Heat-resistant film base-material-inserted B-staged resin composition sheet excellent in adhesion to resin, multilayer board using the sheet and manufacturing process of the multilayer board
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Assignee
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| 5-2, MARUNOUCHI 2-CHOME |
| CHIYODA-KU, TOKYO, JAPAN |
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Correspondence name and address
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WENDEROTH LIND & PONACK, LLP
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MATTHEW M. JACOB, ESQ.
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2033 K STREET, N.W.
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SUIE 800
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WASHINGTON, DC 20006-1021
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