Patent Assignment Details
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| Reel/Frame: | 014701/0963 | |
| Pages: | 9 |
| | Recorded: | 11/17/2003 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/18/2005
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Application #:
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10433525
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Filing Dt:
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11/13/2003
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Publication #:
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Pub Dt:
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04/29/2004
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Title:
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METHOD FOR JOINING A SILICON PLATE TO A SECOND PLATE
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Assignee
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| POSTFACH 30 02 20 |
| D-70442 STUTTGART, GERMANY |
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Correspondence name and address
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KENYON & KENYON
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RICHARD L. MAYER
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ONE BROADWAY
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NEW YORK, NY 10004
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