Patent Assignment Details
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Reel/Frame: | 014716/0637 | |
| Pages: | 3 |
| | Recorded: | 11/18/2003 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/23/2005
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Application #:
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10715990
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Filing Dt:
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11/18/2003
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Publication #:
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Pub Dt:
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06/03/2004
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Title:
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WIRE LOOP, SEMICONDUCTOR DEVICE HAVING SAME, WIRE BONDING METHOD AND WIRE BONDING APPARATUS
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Assignee
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1-5, SAKAECHO 3-CHOME, HAMURA-SHI |
TOKYO, JAPAN |
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Correspondence name and address
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SNELL & WILMER LLP
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JOSEPH W. PRICE
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1920 MAIN STREET, SUITE 1200
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IRVINE, CA 92614
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