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Patent Assignment Details
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Reel/Frame:014716/0714   Pages: 2
Recorded: 11/17/2003
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
02/13/2007
Application #:
10713213
Filing Dt:
11/17/2003
Publication #:
Pub Dt:
09/30/2004
Title:
Semiconductor device having a chip-chip structure
Assignor
1
Exec Dt:
10/29/2003
Assignee
1
1006, OAZA KADOMA, KADOMA-SHI
OSAKA 571-0050, JAPAN
Correspondence name and address
STEVENS, DAVIS , MILLER ET AL.
JAMES E. LEDBETTER
1615 L. STREET, NW, SUITE 850
WASHINGTON, DC 20036

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