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Patent Assignment Details
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Reel/Frame:014730/0967   Pages: 2
Recorded: 06/15/2004
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
10785969
Filing Dt:
02/26/2004
Publication #:
Pub Dt:
12/16/2004
Title:
SEMICONDUCTOR DEVICE INCLUDING A SEMICONDUCTOR CHIP HAVING TERMINAL CONNECTION BUMPS FORMED OF TWO-LAYER WIRE
Assignors
1
Exec Dt:
02/02/2004
2
Exec Dt:
02/02/2004
3
Exec Dt:
02/02/2004
4
Exec Dt:
02/02/2004
5
Exec Dt:
02/03/2004
6
Exec Dt:
02/02/2004
7
Exec Dt:
02/02/2004
Assignee
1
1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU,
KAWASAKI-SHI, KANAGAWA, JAPAN 211-8588
Correspondence name and address
ARMSTRONG, KRATZ, QUINTOS, HANSON & BROO
1725 K STREET, NW
SUITE 1000
WASHINGTON, DC 20006

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