Patent Assignment Details
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| Reel/Frame: | 014736/0880 | |
| Pages: | 4 |
| | Recorded: | 11/20/2003 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/06/2006
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Application #:
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10719379
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Filing Dt:
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11/20/2003
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Publication #:
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Pub Dt:
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05/27/2004
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Title:
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METHOD OF RESIN ENCAPSULATION, APPARATUS FOR RESIN ENCAPSULATION, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND RESIN MATERIAL
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Assignees
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| 5, KAMITOBA KAMICHOSHI-CHO MINAMI-KU, KYOTO-SHI |
| KYOTO, JAPAN |
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| 1-1, KAMIKODANAKA 4-CHOME NAKAHARA-KU, KAWASAKI-SHI |
| KANAGAWA 211-8588, JAPAN |
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Correspondence name and address
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FASSE PATENT ATTORNEYS, PA
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WALTER F. FASSE
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P.O. BOX 726
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HAMPDEN, MAINE 04444-0726
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