Patent Assignment Details
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| Reel/Frame: | 014743/0028 | |
| Pages: | 3 |
| | Recorded: | 06/17/2004 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
4
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Patent #:
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Issue Dt:
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02/12/2002
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Application #:
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09461329
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Filing Dt:
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12/15/1999
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Title:
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WAFER/LOADINGUNLOADING DEVICE AND METHOD FOR PRODUCING WAFERS
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Patent #:
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Issue Dt:
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08/28/2001
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Application #:
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09497854
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Filing Dt:
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02/04/2000
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Title:
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Wafer polishing apparatus and wafer manufacturing method
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Patent #:
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Issue Dt:
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06/04/2002
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Application #:
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09523757
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Filing Dt:
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03/13/2000
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Title:
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WAFER TRANSFER APPARATUS AND WAFER POLISHING APPARATUS, AND METHOD FOR MANUFACTURING WAFER
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Patent #:
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Issue Dt:
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06/05/2001
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Application #:
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09525322
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Filing Dt:
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03/13/2000
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Title:
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Wafer holding head and wafer polishing apparatus, and method for manufacturing wafers
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Assignee
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| 11-1, HANEDA ASAHI-CHO, OHTA-KU |
| TOKYO 144-8510, JAPAN |
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Correspondence name and address
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OBLON, SPIVAK, MCCLELLAND, MAIER & NEUST
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1940 DUKE STREET
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ALEXANDRIA, VA 22314
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ATTN: MARVIN J. SPIVAK
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