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Patent Assignment Details
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Reel/Frame:014749/0021   Pages: 4
Recorded: 11/25/2003
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
05/08/2007
Application #:
10722226
Filing Dt:
11/25/2003
Publication #:
Pub Dt:
05/26/2005
Title:
HIGH PERFORMANCE CHIP CARRIER SUBSTRATE
Assignors
1
Exec Dt:
11/18/2003
2
Exec Dt:
11/14/2003
Assignee
1
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondence name and address
IBM CORPORATION
WILLIAM H. STEINBERG
INTELLECTUAL PROPERTY LAW DEPT.
DEPT. 1Q0A/040-3
ENDICOTT, NEW YORK 13760

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