Patent Assignment Details
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| Reel/Frame: | 014809/0104 | |
| Pages: | 7 |
| | Recorded: | 12/13/2003 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/14/2006
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Application #:
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10735117
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Filing Dt:
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12/13/2003
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Publication #:
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Pub Dt:
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06/16/2005
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Title:
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STRUCTURE AND METHOD FOR FABRICATING A BOND PAD STRUCTURE
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Assignee
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| 60 WOODLANDS INDUSTRIAL PARK D. STREET 2 |
| SINGAPORE, SINGAPORE 7384066 |
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Correspondence name and address
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WILILAM J. STOFFEL
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1735 MARKET ST - STE A
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PMB 455
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PHILADELPHIA, PA 19103
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