Patent Assignment Details
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| Reel/Frame: | 014821/0349 | |
| Pages: | 2 |
| | Recorded: | 12/16/2003 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/19/2005
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Application #:
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10738863
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Filing Dt:
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12/16/2003
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Publication #:
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Pub Dt:
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08/19/2004
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Title:
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CHIP-TYPE CAPACITOR, METHOD OF MANUFACTURING THE SAME AND MOLDING DIE
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Assignees
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| 7-1, KORIYAMA 6-CHOME, |
| TAIHAKU-KU, SENDAI-SHI |
| MIYAGI, JAPAN |
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| 560, NYUZEN, NYUZEN-MACHI |
| SHIMONIKAWA-GUN, TOYAMA, JAPAN |
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Correspondence name and address
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FRISHAUF, HOLTZ, GOODMAN & CHICK, P.C.
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DOUGLAS HOLTZ
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767 THIRD AVENUE
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25TH FLOOR
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NEW YORK, NEW YORK 10017-2023
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