Patent Assignment Details
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Reel/Frame: | 014842/0102 | |
| Pages: | 3 |
| | Recorded: | 12/31/2003 | | |
Conveyance: | CORRECTED COVER SHEET TO CORRECT ASSIGNEE NAME, PREVIOUSLSY RECORDED AT REEL/FRAME 014202/0131 (ASSIGNMENT OF ASSIGNOR'S INTEREST) |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/29/2006
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Application #:
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10464790
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Filing Dt:
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06/19/2003
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Publication #:
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Pub Dt:
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08/19/2004
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Title:
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METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE WITH COPPER WIRING TREATED IN A PLASMA DISCHARGE
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Assignee
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4-1, MARUNOUCHI 2-CHOME |
CHIYODA-KU |
TOKYO, JAPAN 100-6334 |
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Correspondence name and address
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LEYDIG, VOIT & MAYER
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JEFFREY A. WYAND
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700 THIRTEENTH ST., N.W.
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SUITE 300
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WASHINGTON, D.C. 20005-3960
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