Patent Assignment Details
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Reel/Frame: | 014878/0215 | |
| Pages: | 6 |
| | Recorded: | 01/12/2004 | | |
Conveyance: | CORRECTIVE COVERSHEET TO CORRECT THE NAME OF THE ASSIGNEE THAT WAS PREVIOUSLY RECORDED ON REEL 014047, FRAME 0911. |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/16/2005
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Application #:
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10155089
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Filing Dt:
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05/28/2002
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Publication #:
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Pub Dt:
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12/12/2002
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Title:
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METHOD OF PACKAGING ELECTRONIC COMPONENTS WITH HIGH RELIABILITY
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Assignee
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7-1, SHIBA 5-CHOME |
MINATO-KU |
TOKYO, JAPAN |
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Correspondence name and address
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DICKSTEIN SHAPIRO MORIN & OSHINSKY LLP
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STEVEN I. WEISBURD
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1177 AVENUE OF THE AMERICAS, 41ST FLOOR
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NEW YORK, NY 10036-2714
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