Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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Reel/Frame: | 014913/0545 | |
| Pages: | 6 |
| | Recorded: | 07/28/2004 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
5
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Patent #:
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Issue Dt:
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01/21/2003
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Application #:
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09563784
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Filing Dt:
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04/29/2000
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Title:
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THROUGHPUT ENHANCEMENT FOR SINGLE WAFER REACTOR
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10022316
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Filing Dt:
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12/18/2001
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Publication #:
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Pub Dt:
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06/19/2003
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Title:
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Wafer carrier for semiconductor process tool
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10033768
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Filing Dt:
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12/26/2001
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Publication #:
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Pub Dt:
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11/21/2002
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Title:
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System and method of processing composite substrates within a high throughput reactor
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Patent #:
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Issue Dt:
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08/30/2005
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Application #:
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10191664
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Filing Dt:
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07/09/2002
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Publication #:
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Pub Dt:
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01/15/2004
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Title:
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HETEROJUNCTION FIELD EFFECT TRANSISTORS USING SILICON-GERMANIUM AND SILICON-CARBON ALLOYS
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10738353
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Filing Dt:
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12/17/2003
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Publication #:
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Pub Dt:
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06/23/2005
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Title:
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Semiconductor alloy with low surface roughness, and method of making the same
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Assignee
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233 KANSAS STREET |
EL SEGUNDO, CALIFORNIA 90245 |
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Correspondence name and address
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OSTROLENK, FABER, & SOFFEN, LLP
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SAMUEL H. WEINER
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1180 AVENUE OF THE AMERICS
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NEW YORK, NEW YORK 10036-8403
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