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Patent Assignment Details
NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Reel/Frame:014913/0545   Pages: 6
Recorded: 07/28/2004
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 5
1
Patent #:
Issue Dt:
01/21/2003
Application #:
09563784
Filing Dt:
04/29/2000
Title:
THROUGHPUT ENHANCEMENT FOR SINGLE WAFER REACTOR
2
Patent #:
NONE
Issue Dt:
Application #:
10022316
Filing Dt:
12/18/2001
Publication #:
Pub Dt:
06/19/2003
Title:
Wafer carrier for semiconductor process tool
3
Patent #:
NONE
Issue Dt:
Application #:
10033768
Filing Dt:
12/26/2001
Publication #:
Pub Dt:
11/21/2002
Title:
System and method of processing composite substrates within a high throughput reactor
4
Patent #:
Issue Dt:
08/30/2005
Application #:
10191664
Filing Dt:
07/09/2002
Publication #:
Pub Dt:
01/15/2004
Title:
HETEROJUNCTION FIELD EFFECT TRANSISTORS USING SILICON-GERMANIUM AND SILICON-CARBON ALLOYS
5
Patent #:
NONE
Issue Dt:
Application #:
10738353
Filing Dt:
12/17/2003
Publication #:
Pub Dt:
06/23/2005
Title:
Semiconductor alloy with low surface roughness, and method of making the same
Assignor
1
Exec Dt:
07/19/2004
Assignee
1
233 KANSAS STREET
EL SEGUNDO, CALIFORNIA 90245
Correspondence name and address
OSTROLENK, FABER, & SOFFEN, LLP
SAMUEL H. WEINER
1180 AVENUE OF THE AMERICS
NEW YORK, NEW YORK 10036-8403

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