Patent Assignment Details
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| Reel/Frame: | 014968/0939 | |
| Pages: | 3 |
| | Recorded: | 02/06/2004 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/10/2007
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Application #:
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10773517
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Filing Dt:
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02/06/2004
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Publication #:
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Pub Dt:
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06/30/2005
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Title:
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METHOD AND APPARATUS FOR RAPID COOLDOWN OF ANNEALED WAFER
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Assignee
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| 18 ZHANG JIANG ROAD, PUDONG NEW AREA |
| SHANGHAI, CHINA 201203 |
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Correspondence name and address
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RICHARD T. OGAWA
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TOWNSEND AND TOWNSEND AND CREW LLP
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TOW EMBARCADERO CENTER, EIGHTH FLOOR
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SAN FRANCISCO, CA 94111-3834
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