Patent Assignment Details
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| Reel/Frame: | 014977/0813 | |
| Pages: | 4 |
| | Recorded: | 02/10/2004 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/07/2006
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Application #:
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10775395
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Filing Dt:
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02/10/2004
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Publication #:
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Pub Dt:
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09/23/2004
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Title:
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SOLDER BONDING TECHNIQUE FOR ASSEMBLING A TILTED CHIP OR SUBSTRATE
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Assignees
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| 1768 AUTOMATION PARKWAY |
| SAN JOSE, CALIFORNIA 95131 |
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| 3000 MERIVALE ROAD |
| OTTAWA, ONTARIO, CANADA K2G 6N7 |
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Correspondence name and address
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ALLEN, DYER, DOPPELT, ET AL.
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CHARLES E. WANDS
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1901 S. HARBOR CITY BLVD.
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SUITE 507
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MELBOURNE, FL 32901
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