Patent Assignment Details
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Reel/Frame: | 014984/0167 | |
| Pages: | 3 |
| | Recorded: | 02/05/2004 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10774194
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Filing Dt:
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02/05/2004
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Publication #:
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Pub Dt:
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08/11/2005
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Title:
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Method and apparatus for infilm defect reduction for electrochemical copper deposition
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Assignee
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PO BOX 450A |
SANTA CLARA, CALIFORNIA 95052 |
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Correspondence name and address
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APPLIED MATERIALS, INC.
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PATENT COU NSEL
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P.O. BOX 450-A
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SANTA CLARA, CA 95052
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