Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 014990/0037 | |
| Pages: | 5 |
| | Recorded: | 02/19/2004 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
6
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/27/2002
|
Application #:
|
08954426
|
Filing Dt:
|
10/20/1997
|
|
Publication #:
|
|
Pub Dt:
|
08/09/2001
| | | | |
|
Title:
|
CHIP SCALE PACKAGE USING LARGE DUCTILE SOLDER BALLS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/11/2001
|
Application #:
|
09114204
|
Filing Dt:
|
07/13/1998
|
|
Title:
|
METHOD FOR FORMING CHIP SCALE PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/06/2006
|
Application #:
|
09575298
|
Filing Dt:
|
05/19/2000
|
|
Title:
|
SOLDER BAR FOR HIGH POWER FLIP CHIPS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/17/2003
|
Application #:
|
09668450
|
Filing Dt:
|
09/22/2000
|
|
Title:
|
POLYMER COLLAR FOR SOLDER BUMPS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/03/2002
|
Application #:
|
09766798
|
Filing Dt:
|
01/22/2001
|
|
Publication #:
|
|
Pub Dt:
|
07/25/2002
| | | | |
|
Title:
|
ELECTROLESS NI/PD/AU METALLIZATION STRUCTURE FOR COPPER INTERCONNECT SUBSTRATE AND METHOD THEREFOR
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/15/2004
|
Application #:
|
09885846
|
Filing Dt:
|
06/20/2001
|
|
Publication #:
|
|
Pub Dt:
|
10/18/2001
| | | | |
|
Title:
|
METHOD FOR FORMING CHIP SCALE PACKAGE
|
|
|
Assignee
|
|
|
|
|
| 2448 NORTH ROSE STREET |
| MESA, ARIZONA 85213 |
|
|
Correspondence name and address
|
| |
SUSAN M. DALY
|
| |
2375 EAST CAMELBACK ROAD
|
| |
SUITE 700
|
| |
PHOENIX, AZ 85016
|
Search Results as of:
05/15/2024 05:52 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
