Patent Assignment Details
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| Reel/Frame: | 015025/0565 | |
| Pages: | 2 |
| | Recorded: | 03/03/2004 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10714497
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Filing Dt:
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11/14/2003
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Publication #:
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Pub Dt:
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06/24/2004
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Title:
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Method for manufacturing a semiconductor device having multiple laminated layers of different materials
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Assignee
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| 5-5, KEIHAN-HONDORI 2-CHOME, MORIGUCHI-SHI |
| OSAKA, JAPAN |
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Correspondence name and address
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HOGAN & HARTSON L.L.P.
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ANTHONY J. ORLER, ESQ.
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500 SOUTH GRAND AVENUE, SUITE 1900
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LOS ANGELES, CA 90071
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