Patent Assignment Details
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| Reel/Frame: | 015031/0282 | |
| Pages: | 2 |
| | Recorded: | 02/26/2004 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/04/2005
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Application #:
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10788739
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Filing Dt:
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02/26/2004
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Publication #:
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Pub Dt:
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09/01/2005
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Title:
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METHOD TO PREVENT PASSIVATION LAYER PEELING IN A SOLDER BUMP FORMATION PROCESS
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Assignee
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| NO. 8. LI-HSIN RD. 6 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN R.O.C. |
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Correspondence name and address
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TUNG & ASSOCIATES
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RANDY W. TUNG
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838 W. LONG LAKE ROAD
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SUITE 120
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BLOOMFIELD HILL, MI 48302
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