Patent Assignment Details
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| Reel/Frame: | 015036/0029 | |
| Pages: | 3 |
| | Recorded: | 02/20/2004 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/05/2011
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Application #:
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10781795
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Filing Dt:
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02/20/2004
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Publication #:
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Pub Dt:
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08/26/2004
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Title:
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THIN FILM INTEGRATED CIRCUIT DEVICE, IC LABEL, CONTAINER COMPRISING THE THIN FILM INTEGRATED CIRCUIT, MANUFACTURING METHOD OF THE THIN FILM INTEGRATED CIRCUIT DEVICE, MANUFACTURING METHOD OF THE CONTAINER, AND MANAGEMENT METHOD OF PRODUCT HAVING THE CONTAINER
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Assignee
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| 398, HASE ATSUGI-SHI |
| KANAGAWA-KEN, JAPAN 243-0036 |
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Correspondence name and address
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ROBINSON INTELLECTUAL ET AL.
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ERIC J. ROBINSON
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PMB 955
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21010 SOUTHBANK STREET
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POTOMAC FALLS, VA 20165
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