Patent Assignment Details
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| Reel/Frame: | 015092/0083 | |
| Pages: | 2 |
| | Recorded: | 03/12/2004 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10799069
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Filing Dt:
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03/12/2004
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Publication #:
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Pub Dt:
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09/09/2004
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Title:
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Heating furnace and semiconductor wafer-holding jig assembly and process of manufacturing semiconductor devices
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Assignees
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| 2578-1, NOROITO TAMA-KU |
| KAWSAKI-CITY, KANAGAWA, JAPAN |
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| 11F, NO. 236, HSIN-YI RD., SEC. 4 |
| DA-AN DRISTRICT |
| TAIPEI CITY, TAIWAN R.O.C. |
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Correspondence name and address
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THOMAS, KAYDEN, HORSTEMEYER & RISLEY
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DANIEL R. MCCLURE
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100 GALLERIA PARKWAY
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SUITE 1750
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ATLANTA, GA 30339-5948
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