Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Reel/Frame: | 015151/0266 | |
| Pages: | 5 |
| | Recorded: | 09/20/2004 | | |
Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE 2ND INVENTOR'S EXECUTION DATE PREVIOUSLY RECORDED ON REEL 013434 FRAME 0473. ASSIGNOR(S) HEREBY CONFIRMS THE CORRECTIVE ASSIGNMENT. |
|
Total properties:
1
|
|
Patent #:
|
|
Issue Dt:
|
10/12/2004
|
Application #:
|
10279900
|
Filing Dt:
|
10/24/2002
|
Publication #:
|
|
Pub Dt:
|
04/29/2004
| | | | |
Title:
|
COST EFFECTIVE SUBSTRATE FABRICATION FOR FLIP-CHIP PACKAGES
|
|
Assignee
|
|
|
5 YISHUN ST. 23 |
SINGAPORE 768442, SINGAPORE |
|
Correspondence name and address
|
|
MIKIO ISHIMARU
|
|
THE LAW OFFICES OF MIKIO ISHIMARU
|
|
1110 SUNNYVALE-SARATOGA RD., STE. A1
|
|
SUNNYVALE, CA 94087
|
Search Results as of:
05/16/2024 04:27 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|