Patent Assignment Details
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| Reel/Frame: | 015161/0417 | |
| Pages: | 2 |
| | Recorded: | 03/30/2004 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/30/2006
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Application #:
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10811857
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Filing Dt:
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03/30/2004
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Publication #:
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Pub Dt:
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10/13/2005
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Title:
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LEADLESS SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
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Assignee
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| NO. 26, CHIN 3RD RD., NANTZE EXPORT |
| PROCESSING ZONE |
| KAOHSIUNG, TAIWAN R.O.C. |
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Correspondence name and address
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LOWE HAUPTMAN GILMAN & BERNER
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BENJAMIN J. HAUPTMAN
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1700 DIAGONAL ROAD, SUITE 300
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ALEXANDRIA, VA 22314
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