Patent Assignment Details
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| Reel/Frame: | 015164/0652 | |
| Pages: | 4 |
| | Recorded: | 03/30/2004 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10812562
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Filing Dt:
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03/30/2004
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Publication #:
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Pub Dt:
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10/06/2005
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Title:
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Wafer polishing control system for chemical mechanical planarization machines
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Assignee
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| 2-3 MARUNOUCHI, 3-CHOME, CHIYODA KU |
| TOKYO, JAPAN |
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Correspondence name and address
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RITTER, LANG & KAPLAN LLP
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PEGGY A. SU
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12930 SARATOGA AVENUE, SUITE D1
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SARATOGA, CA 95070
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