Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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Reel/Frame: | 015177/0122 | |
| Pages: | 10 |
| | Recorded: | 04/06/2004 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
4
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Patent #:
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Issue Dt:
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10/30/2001
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Application #:
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09514084
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Filing Dt:
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02/28/2000
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Title:
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Method and apparatus for ablating high-density array of vias or indentation in surface of object
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Patent #:
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Issue Dt:
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07/16/2002
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Application #:
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09540366
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Filing Dt:
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03/31/2000
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Title:
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CONTROL SYSTEM FOR ABLATING HIGH-DENSITY ARRAY OF VIAS OR INDENTATION IN SURFACE OF OBJECT
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Patent #:
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Issue Dt:
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07/03/2001
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Application #:
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09540367
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Filing Dt:
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03/31/2000
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Title:
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Apparatus for ablating high-density array of vias or indentation in surface of object
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Patent #:
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Issue Dt:
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11/25/2003
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Application #:
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10183806
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Filing Dt:
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06/26/2002
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Publication #:
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Pub Dt:
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11/07/2002
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Title:
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CONTROL SYSTEM FOR ABLATING HIGH-DENSITY ARRAY OF VIAS OR INDENTATION IN SURFACE OF OBJECT
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Assignee
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2100 KAMI-IMAIZUMI |
EBINA-SHI, KANAGAWA, JAPAN 243-0488 |
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Correspondence name and address
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DAVIS & BUJOLD, P.L.L.C.
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FOURTH FLOOR
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500 N. COMMERCIAL STREET
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MANCHESTER, NH 03101-1151
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