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Patent Assignment Details
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Reel/Frame:015195/0387   Pages: 2
Recorded: 04/12/2004
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
05/29/2007
Application #:
10820852
Filing Dt:
04/09/2004
Publication #:
Pub Dt:
10/21/2004
Title:
FLIP CHIP BONDER
Assignors
1
Exec Dt:
03/30/2004
2
Exec Dt:
03/30/2004
3
Exec Dt:
03/30/2004
4
Exec Dt:
03/30/2004
Assignee
1
14-3, HIGASHI-KOJIYA 2-CHOME
OTA-KU, TOKYO 144-8650, JAPAN
Correspondence name and address
SMITH, GAMBRELL & RUSSELL
MICHAEL A. MAKUCH
1850 M STREET, N.W.
SUITE 800
WASHINGTON, DC 20036

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