Patent Assignment Details
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| Reel/Frame: | 015207/0530 | |
| Pages: | 2 |
| | Recorded: | 04/14/2004 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/18/2008
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Application #:
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10823649
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Filing Dt:
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04/14/2004
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Publication #:
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Pub Dt:
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03/03/2005
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Title:
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METHOD AND APPARATUS DISTRIBUTION POWER SUPLY PAD OF SEMICONDUCTOR INTEGRATED CIRCUIT
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Assignee
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| 1-1, KAMIKODANAKA, 4-CHOME |
| NAKAHARA-KU, KAWASAKI-SHI |
| KANAGAWA, JAPAN 211-8588 |
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Correspondence name and address
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STAAS & HALSEY LLP
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ATTENTION: DAVID M. PITCHER
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1201 NEW YORK AVE., N.W.
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SUITE 700
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WASHINGTON, D.C. 20005
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