Patent Assignment Details
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| Reel/Frame: | 015207/0751 | |
| Pages: | 2 |
| | Recorded: | 04/13/2004 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10822749
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Filing Dt:
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04/13/2004
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Publication #:
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Pub Dt:
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05/19/2005
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Title:
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Semiconductor device including plural chips with protruding edges laminated on a die pad section
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Assignee
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| 7-12, TORANOMON 1-CHOME, MINATO-KU |
| TOKYO, JAPAN |
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Correspondence name and address
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VOLENTINE FRANCOS, PLLC
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ADAM C. VOLENTINE
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12200 SUNRISE VALLEY DRIVE, SUITE 150
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RESTON, VA 20191
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04/30/2024 05:56 PM
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