Patent Assignment Details
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Reel/Frame: | 015208/0741 | |
| Pages: | 3 |
| | Recorded: | 04/19/2004 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/12/2006
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Application #:
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10724954
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Filing Dt:
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12/01/2003
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Publication #:
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Pub Dt:
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08/05/2004
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Title:
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CIRCUIT DEVICE MANUFACTURING METHOD INCLUDING MOUNTING CIRCUIT ELEMENTS ON A CONDUCTIVE FOIL, FORMING SEPARATION GROOVES IN THE FOIL, AND ETCHING THE REAR OF THE FOIL
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Assignees
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5-5, KEIHAN-HONDORI 2-CHOME, MORIGUCHI-SHI |
OSAKA 570-8677, JAPAN |
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2-2468-1, SENGOKU OIZUMI-MACHI, ORA-GUN |
GUNMA, JAPAN |
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Correspondence name and address
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FISH & RICHARDSON P.C.
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SAMUEL BORODACH
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45 ROCKEFELLER PLAZA, SUITE 2800
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NEW YORK, NY 10111
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