Patent Assignment Details
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| Reel/Frame: | 015230/0224 | |
| Pages: | 4 |
| | Recorded: | 04/15/2004 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10825839
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Filing Dt:
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04/15/2004
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Publication #:
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Pub Dt:
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10/20/2005
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Title:
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Semiconductor Packages Comprising Interposer Constructions
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Assignee
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| 8000 SOUTH FEDERAL WAY |
| BOISE, IDAHO 83716 |
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Correspondence name and address
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DAVID G. LATWESEN, PH.D.
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WELLS ST. JOHN
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601 WEST FIRST AVENUE
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SUITE 1300
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SPOKANE, WA 99201
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