Total properties:
113
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2
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2
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Patent #:
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Issue Dt:
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02/18/2003
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Application #:
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10132051
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Filing Dt:
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04/24/2002
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Publication #:
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Pub Dt:
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08/22/2002
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Title:
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TEST SYSTEM HAVING INTERFACE MODULE
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Patent #:
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Issue Dt:
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02/08/2005
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Application #:
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10136710
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Filing Dt:
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04/30/2002
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Publication #:
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Pub Dt:
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01/23/2003
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Title:
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OPEN-LOOP FOR WAVEFORM ACQUISITION
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Patent #:
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Issue Dt:
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01/25/2005
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Application #:
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10159527
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Filing Dt:
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05/30/2002
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Publication #:
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Pub Dt:
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12/26/2002
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Title:
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SUB-RESOLUTION ALIGNMENT OF IMAGES
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Patent #:
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Issue Dt:
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02/15/2005
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Application #:
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10160606
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Filing Dt:
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05/30/2002
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Publication #:
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Pub Dt:
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12/04/2003
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Title:
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METHOD AND APPARATUS FOR FORMING A CAVITY IN A SEMICONDUCTOR SUBSTRATE USING A CHARGED PARTICLE BEAM
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Patent #:
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Issue Dt:
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10/18/2005
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Application #:
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10161272
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Filing Dt:
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05/30/2002
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Publication #:
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Pub Dt:
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12/04/2003
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Title:
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METHOD FOR DETERMINING THICKNESS OF A SEMICONDUCTOR SUBSTRATE AT THE FLOOR OF A TRENCH
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Patent #:
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Issue Dt:
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06/01/2004
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Application #:
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10197134
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Filing Dt:
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07/16/2002
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Publication #:
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Pub Dt:
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01/22/2004
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Title:
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TEST SYSTEM AND METHODOLOGY
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Patent #:
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Issue Dt:
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06/14/2005
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Application #:
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10288896
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Filing Dt:
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11/06/2002
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Publication #:
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Pub Dt:
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07/17/2003
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Title:
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PRECISE, IN-SITU ENDPOINT DETECTION FOR CHARGED PARTICLE BEAM PROCESSING
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10371353
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Filing Dt:
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02/18/2003
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Publication #:
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Pub Dt:
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08/21/2003
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Title:
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Signal paths providing multiple test configurations
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Patent #:
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Issue Dt:
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08/24/2004
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Application #:
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10382343
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Filing Dt:
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03/04/2003
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Publication #:
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Pub Dt:
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09/09/2004
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Title:
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METHOD AND APPARATUS FOR ACCESSING INTERNAL NODES OF AN INTEGRATED CIRCUIT USING IC PACKAGE SUBSTRATE
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10420675
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Filing Dt:
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04/21/2003
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Publication #:
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Pub Dt:
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05/06/2004
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Title:
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Method for surface preparation to enable uniform etching of polycrystalline materials
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10421059
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Filing Dt:
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04/23/2003
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Publication #:
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Pub Dt:
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01/22/2004
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Title:
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Method for backside die thinning and polishing of packaged integrated circuits
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Patent #:
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Issue Dt:
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12/27/2005
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Application #:
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10466366
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Filing Dt:
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12/08/2003
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Publication #:
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Pub Dt:
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05/06/2004
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Title:
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POWER SUPPLY DEVICE FOR A COMPONENT TESTING INSTALLATION
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Patent #:
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Issue Dt:
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06/13/2006
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Application #:
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10678438
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Filing Dt:
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10/03/2003
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Publication #:
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Pub Dt:
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04/07/2005
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Title:
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FIB MILLING OF COPPER OVER ORGANIC DIELECTRICS
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