Patent Assignment Details
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| Reel/Frame: | 015274/0737 | |
| Pages: | 3 |
| | Recorded: | 04/30/2004 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/29/2004
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Application #:
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10322900
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Filing Dt:
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12/18/2002
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Publication #:
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Pub Dt:
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08/21/2003
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Title:
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LEAD FRAME FOR A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE INCORPORATING THE LEAD FRAME
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Assignee
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| 10-1, KOMINE 2-CHOME, YAHATANISHI-KU |
| KITAKYUSHI-SHI, FUKUOKA, JAPAN |
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Correspondence name and address
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WOOD, PHILLIPS, KATZ, CLARK & MORTIMER
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JOHN S. MORTIMER
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500 WEST MADISON STREET
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CITICORP CENTER, SUITE 3800
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CHICAGO, IL 60661-2511
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