Patent Assignment Details
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| Reel/Frame: | 015302/0047 | |
| Pages: | 4 |
| | Recorded: | 04/27/2004 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/24/2002
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Application #:
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09505938
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Filing Dt:
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02/15/2000
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Title:
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WAFER LEVEL PACKAGE AND THE PROCESS OF THE SAME
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Assignee
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| NO. 65, KUANG-FU N. RD., HSIN-CHU INDUSTRIAL PARK HU-KOU |
| HSIN-CHU HSIEN, 303, TAIWAN R.O.C. |
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Correspondence name and address
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LAW OFFICES OF CLEMENT CHENG
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CLEMENT CHENG
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17220 NEWHOPE STREET
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SUITE 127
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FOUNTAIN VALLEY, CA 92708
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