Patent Assignment Details
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| Reel/Frame: | 015320/0542 | |
| Pages: | 46 |
| | Recorded: | 11/01/2004 | | |
| Conveyance: | CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). |
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Total properties:
7
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Patent #:
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Issue Dt:
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12/14/1999
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Application #:
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08687929
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Filing Dt:
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07/29/1996
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Title:
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CHIP CARRIER WITH EMBEDDED LEADS AND CHIP PACKAGE USING SAME
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Patent #:
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Issue Dt:
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03/02/1999
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Application #:
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08749963
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Filing Dt:
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11/18/1996
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Title:
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PLATE AND COLUMN TYPE SEMICONDUCTOR PACKAGE HAVING HEAT SINK
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Patent #:
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Issue Dt:
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07/25/2000
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Application #:
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08785019
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Filing Dt:
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01/17/1997
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Title:
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LEAD FRAME HAVING SUPPORTERS AND SEMICONDUCTOR PACKAGE USING SAME
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Patent #:
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Issue Dt:
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04/27/1999
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Application #:
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08785592
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Filing Dt:
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01/17/1997
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Title:
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LEAD FRAME AND SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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11/14/2000
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Application #:
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08956387
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Filing Dt:
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10/23/1997
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Title:
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METHOD FOR FORMING METAL LINE OF SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
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10/05/1999
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Application #:
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09027185
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Filing Dt:
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02/20/1998
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Title:
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FABRICATION METHOD FOR SEMICONDUCTOR PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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01/09/2001
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Application #:
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09233463
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Filing Dt:
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01/20/1999
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Title:
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DEVICE ISOLATION STRUCTURE AND DEVICE ISOLATION METHOD FOR A SEMICONDUCTOR POWER INTEGRATED CIRCUIT
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Assignee
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| SAN 136-1, AMI-RI, BUBAL-EUB, ICHON-SHI |
| KYOUNGKI-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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BLAKELY, SOKOLOFF, TAYLOR & ZAFNAN
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ERIC S. HYMAN
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12400 WILSHIRE BOULEVARD, SEVENTH FLOOR
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LOS ANGELES, CALIFORNIA 90025
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