Patent Assignment Details
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Reel/Frame: | 015324/0708 | |
| Pages: | 4 |
| | Recorded: | 11/02/2004 | | |
Attorney Dkt #: | TSMC 2004-0523 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10904283
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Filing Dt:
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11/02/2004
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Publication #:
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Pub Dt:
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05/04/2006
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Title:
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Fine pitch bonding pad layout and method of manufacturing same
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Correspondence name and address
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BAKER & MCKENZIE
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ON BEHALF OF TSMC
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2300 TRAMMELL CROW CENTER
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2001 ROSS AVENUE, SUITE 2300
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DALLAS, TX 75201
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05/17/2024 08:50 PM
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