Patent Assignment Details
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Reel/Frame: | 015357/0936 | |
| Pages: | 2 |
| | Recorded: | 05/18/2004 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/29/2007
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Application #:
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10848649
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Filing Dt:
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05/18/2004
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Publication #:
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Pub Dt:
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11/24/2005
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Title:
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SUBSTRATE FOR SOLDER JOINT
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Assignee
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NO. 2, LI-HSIN ROAD, 3, SCIENCE-BASED INDUSTRIAL PARK |
HSIN-CHU, TAIWAN R.O.C. |
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Correspondence name and address
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ANDERSON KILL & OLICK, P.C.
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EUGENE LIBERSTEIN
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1251 AVENUE OF THE AMERICAS
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42ND STREET
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NEW YORK, NY 10020
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