Patent Assignment Details
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| Reel/Frame: | 015443/0199 | |
| Pages: | 3 |
| | Recorded: | 06/08/2004 | | |
| Attorney Dkt #: | 32307-201671 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/18/2006
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Application #:
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10792884
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Filing Dt:
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03/05/2004
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Publication #:
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Pub Dt:
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09/23/2004
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Title:
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FABRICATION METHOD OF SEMICONDUCTOR WAFER
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Assignees
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| 1-11-2 OSAKI, SHINAGAWA-KU |
| TOKYO, JAPAN 141-0032 |
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| 4-2, MARUNOUCHI 1-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 100-0005 |
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Correspondence name and address
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VENABLE, BAETJER, HOWARD AND CIVILETTI,
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P.O. BOX 34385
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WASHINGTON, DC 20043-9998
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